Return-Path: Delivered-To: contact@reparatii-laptopuri.ro Received: (qmail 18153 invoked by uid 1008); 22 Oct 2014 11:55:30 +0300 Received: by simscan 1.4.0 ppid: 18147, pid: 18148, t: 2.0116s scanners: regex: 1.4.0 clamav: 0.97.2 /m: spam: 3.3.1 X-Spam-Checker-Version: SpamAssassin 3.3.2 (2011-06-06) on zenit X-Spam-Level: X-Spam-Status: No, score=0.0 required=5.5 tests=HTML_MESSAGE, RCVD_IN_DNSWL_NONE,T_DKIM_INVALID autolearn=disabled version=3.3.2 Received: from 105-64.mta.dotmailer.com (94.143.105.64) by mail.reparatii-laptopuri.ro with SMTP; 22 Oct 2014 11:55:28 +0300 DKIM-Signature: v=1; a=rsa-sha1; c=relaxed/relaxed; s=dkim1024; d=my-futureproductnewsletter.com; h=From:To:Subject:MIME-Version:Content-Type:Date:List-Unsubscribe:Reply-To:Message-ID; i=future@my-futureproductnewsletter.com; bh=4gAm0bHq+i1SF0/WyR5dRjWGLH0=; b=Qz9Z4OYQtTZrzhoaRNMu+Hr0DRhx+2oBB5XvQ/QoU+xW7aw6RlxYqaYMnBXNgHOx98Ln8bnTel3k RiE42/eqKC9gralFiC5M9yotkZeVXKN2/4Ky41dMgYBH/LHCR6sYVYcvuDr5c0vXqVICyvWCGSe4 afNLQah4pwmAVD5Y6cw= DomainKey-Signature: a=rsa-sha1; c=nofws; q=dns; s=dkim1024; d=my-futureproductnewsletter.com; b=QpJVWaW+QNOBL1E35EKs7gDExjnQvgt6gDcYVGMKdFrLlrhDluUDfLesgLxXHassqw4hppU1iRgS plhYydo09ZOKZLOwZEV2ViEpVbB1bh/FocfJPfSpzyqTI5CzUDpb9DRtLv66nmE7tOOv9WjhSs44 DEPbiS+ybCr5oIeUpm8=; From: "Future Product News" To: "contact@reparatii-laptopuri.ro" Subject: Future's Electronica Special - IoT Collect MIME-Version: 1.0 Content-Type: multipart/alternative; boundary="BFBHX9KLB5:20141022100350408" X-Mailer: dmDroid Date: Wed, 22 Oct 2014 10:03:50 +0100 X-CampaignID: KOCTL X-dmid: 1TFB-2V9CH-BHX9KL List-Unsubscribe: Bounces-to: bo-1TFB-2V9CH-BHX9KL-BZOZ5@my-futureproductnewsletter.com Return-Path: bo-1TFB-2V9CH-BHX9KL-BZOZ5@my-futureproductnewsletter.com Reply-To: "Future Product News" Message-ID: <2V9CH.BFBHX9KLB5.20141022100350408@my-futureproductnewsletter.com> X-AntiVirus: checked (incoming) by Avira MailGuard (Version: 15.0.9.460; AVE:8.3.30.16; VDF:8.11.224.22) --BFBHX9KLB5:20141022100350408 Content-Type: text/plain; charset="utf-8" Content-Transfer-Encoding: quoted-printable ( future@my-futureproductnewsletter.com ) future@my-futureproductnewsletter.com ( future@my-futureproductnewsletter= .com ) ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-1AP8LN-0/c.aspx= ) ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-1AP8LO-0/c.aspx= ) ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-1AP8LP-0/c.aspx= ) ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-1AP8LQ-0/c.aspx= ) Product Newsletter - Sep 14 ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-1AP8LR-0/c.aspx= ) In This Issue: Collect your IoT Solutions Cube at Electronica Stand A4-259=20 Compact & rugged gyroscopes=20 Accurate temperature sensing=20 Humidity & temperature sensor MEMS pressure sensors=20 Actuator sensors=20 Proximity sensors=20 Light sensors=20 Sound sensors Rugged MEMS gyroscopes combine accuracy with stability and power savings ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-1AP8LS-0/c.aspx= ) With analogue or digital outputs and excellent noise immunity, STMicroele= ctronics=E2=80=99 silicon-based MEMS gyroscopes also offer superior stabi= lity over time and temperature, as well as low power consumption. Whilst the three-axis sensors include a full-scale range up to =C2=B12000= dps and an embedded FIFO for smart data storage and power management, the= range also includes single- and dual-axis gyroscopes. Find out more! ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-= 1AP8LS-0/c.aspx ) Accurate and robust temperature sensing for digital or analogue designs ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-1AP8LT-0/c.aspx= ) The latest digital-output temperature-sensor ICs combine multi-channel op= eration for remote-sensing applications with accuracy down to =C2=B10.25=C2= =B0C in addition to power-saving features and connectivity over I2C, SPI,= SMBus or logic. For analogue outputs, the latest ICs achieve accuracy of =C2=B10.5=C2=B0C= with sensor gains from -10.68 to 19.5 and a wide temperature range of -5= 5 to +130=C2=B0C. Discover more by requesting the Data Pack. Find out more! ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-= 1AP8LT-0/c.aspx ) Humidity and temperature sensing in a single, ultra=E2=80=91compact senso= r ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-1AP8LU-0/c.aspx= ) Packed into a tiny 2 x 2 x 0.9mm package is a sensing element and analogu= e-to-digital conversion which delviers humidity and temperature data as a= 16-bit digital output. STMicroelectronics' factory-calibrated capacitive digital sensor technolo= gy offers high-accuracy for humidity and temperature data, as well as ser= ial connectivity and low power consumption. This sensor is also ECOPACK=C2= =AE compliant. Find out more! ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-= 1AP8LU-0/c.aspx ) Ultra-compact MEMS pressure sensor uses state=E2=80=91of=E2=80=91the-art = VENSENS technology ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-1AP8LV-0/c.aspx= ) The combination of a mono=E2=80=91silicon membrane above an air gap with = a defined pressure enables STMicroelectronics' VENSENS technology to deli= ver high-accuracy pressure sensing with an I2C or SPI output. The high integration of the LPS331AP includes embedded temperature compen= sation and 24=E2=80=91bit ADC with low power consumption and a low operat= ing voltage in a space-saving Ecopack=C2=AE package. Find out more! ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-= 1AP8LV-0/c.aspx ) Choosing technologies for sensing motion, acceleration, shock, position &= speed ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-1AP8LW-0/c.aspx= ) With so many actuators and actuator technologies on the market, choosing = the right one can be complex and time-consuming. This Data Pack from Futu= re includes an actuator for every application. The Data Pack includes analogue and digital accelerometers, a digital com= pass, pyroelectric IR and and phototransistor motion sensors as well as H= all IC, optical and magnetic speed and position sensors. Find out more! ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-= 1AP8LW-0/c.aspx ) Proximity sensing using capacitive, resistive, optical or IR reflective s= ensors ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-1AP8LX-0/c.aspx= ) With capacitive touch sensors moving into more demanding applications, IR= reflective sensors now integrate ambient-light compensation to extend th= eir range from bright sunlight or dark rooms. Resistive sensors now integrate multi-touch gestures and haptic feedback = from an ultra-small footprint, whilst optical sensors have introduced mor= e compact packages. Find out more by requesting the Data Pack. Find out more! ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-= 1AP8LX-0/c.aspx ) Increased integration and flexibility from new light and CMOS image senso= rs ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-1AP8LY-0/c.aspx= ) Analogue light sensors offer the flexibility of converting light to frequ= ency or to voltage whilst the latest digital light sensors integrate anal= ogue=E2=80=91to=E2=80=91digital conversion and serial connectivity for ea= sier interfacing. For CMOS image sensors, there is the flexibility to use wider range of sh= utter options for digital camera and imaging applications, including pipe= lined, triggered global or rolling shutters. Find out more! ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-= 1AP8LY-0/c.aspx ) MEMS Microphones and ultrasonic sensors using piezoelectric ceramic techn= ology ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-1AP8LZ-0/c.aspx= ) The latest MEMS microphones deliver a smaller size and a higher performan= ce compared to conventional electrets condenser microphones and offer low= power consumption and a choice of port location. For ultrasonic sensors, the latest developments include high sensitivity = and reliability combined with a small and lightweight package. To find ou= t more, request the Sound Sensors Data Pack. Find out more! ( http://my-futureproductnewsletter.com/1TFB-2V9CH-BHX9KL-= 1AP8LZ-0/c.aspx ) Future Electronics - EMEA Headquarters - London, Future House, The Glanty= , Egham, Surrey, TW20 9AH, UK If you're having problems viewing this message, please click here http://= my-futureproductnewsletter.com/1TFB-2V9CH-BFBHX9KLB5/cr.aspx Unsubscribe http://my-futureproductnewsletter.com/1TFB-2V9CH-BFBHX9KLB5/u= ns.aspx | Forward to a friend http://my-futureproductnewsletter.com/1TFB-= 2V9CH-BFBHX9KLB5-0/fw.aspx --BFBHX9KLB5:20141022100350408 Content-Type: text/html; charset="utf-8" Content-Transfer-Encoding: quoted-printable Future's Electronica Special - IoT Collect =0A=0A=0A=0A =0A =0A =0A =0A = =0A =0A =0A =0A =0A =0A =0A = =0A =0A =0A =0A = =0A = =0A <= td width=3D"8" valign=3D"top" class=3D"eegap" style=3D"width: 9px; paddin= g-top: 0px;padding-right: 0px;padding-bottom: 0px;padding-left: 0px;">=0A =0A =0A
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Future IoT Special - Oct 14
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In This Issue:
=0A=0A= Collect your IoT Solutions Cube at
Electronica Stand A4-259=0A=0A
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  • 800Mhz DDR3/3L Synch. DRAM
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  • Fast &= ; Micro-Power SRAM
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  • Flash Power vs Performance=0A
  • Scalability with 16-bit MCUs
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  • MCU-based DSP to= 1GHz DSP
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  • Innovative 8-bit MCUs
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  • 32-b= it for Embedded Control
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  • The Flexibility of FPGA
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<= a style=3D"color: rgb(0, 157, 84); font-size: 16px; font-weight: bold; te= xt-decoration: none;" href=3D"http://my-futureproductnewsletter.com/1TFB-= 2V9CH-BHX9KL-1BC8MX-1/c.aspx">800= Mhz DDR3/3L DRAMs increase data rates & offer battery-saving voltages=

The faster data rates and low operating voltages offer= ed by Alliance=E2=80=99s synchronous DDR3 DRAM support high-speed IoT net= working with data rates of up to 1600Mbps/pin and densities to 4Gb.=0A
With densities up to 2Gb, DDR3L DRAMs reduce the operating voltage d= own to 1.35V whilst maintaining the same data transfer rates, and backwar= d compatibility, with the 1.5V DDR3 devices. =0A

Find out more!
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Cypress SRAM optimised for More Battery Life or faster acc= ess times

To extend battery life in IoT applications, C= ypress's micro-power More Battery Life (MoBL=C2=AE) asynchrono= us SRAMs combine benchmark, ultra-low standby power dissipation with auto= matic power-down when de-selected.=0A

High-performance IoT designs= can drive data faster with an access time of 10ns from a 16Mbit asynchro= nous SRAM which also reduces power consumption with its low 1.8V operati= ng voltage.=0A

Find out more!

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Flash technologies answer power, speed and board-space chall= enges

Memory manufacturers have developed Flash technol= ogies to provide solutions to the key IoT design challenges of increasing= speed, reducing power consumption and reducing space whilst still gettin= g to market fast.

Technologies such as SuperFlash=C2=AE= , Multi-Purpose Flash Plus (MPF+), Many-Time Programmable (MTP) and Small= Sector Flash (SSF=E2=84=A2) hold the answer to optimising power and perf= ormance for any IoT application.

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16-bit MCUs focus on security and flexibility for IoT designs
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A single 16-bit PIC=C2=AE microcontroller brings toget= her a hardware crypto engine, random number generator and one-time-progra= mmable key storage, with support for USB OTG and touch-sensing to control= critical IoT functions=0A

The PIC24F GB2 microcontrollers, from M= icrochip, also add eXtreme Low Power (XLP) technology, multiple serial co= mmunication channels and flexible Flash/RAM options to the list of featur= es which enable IoT designs.=0A

Find out m= ore!
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From 1GHz DSP for storage acceleration to mixed-signal MC= Us with DSP/FPU

IoT applications can use digital signal= processors which range from a 32-bit mixed-signal microcontroller with D= SP and FPU; to a single- or dual-core ARM-based DSP; or a high-speed 1GHz= DSP.=0A

DSPs can be used to deliver storage acceleration and adva= nced security; to reduce current consumption with dynamic power scaling; = or to combine high-speed connectivity with on-chip data conversion.=0A
Find out more!
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Add intelligence and add battery-life with= innovative 8-bit MCUs

Perhaps no other architecture o= ffers the extreme optimisation of the 8-bit microcontroller. They are opt= imised for power-saving, code reduction, sensing, graphics, user interfac= ing and so much more.=0A

That means that there is an 8-bit microco= ntroller for virtually any IoT application, from the most cost-sensitive = to the most feature-rich designs. All of them add intelligence and embedd= ed control.=0A

Find out more!


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32-bit control across the full IoT spectrum from entry level= to high end

32-bit processing for the IoT comes with a= choice of an ARM=E2=84=A2 Cortex=E2=84=A2 cores or= a microAptiv core, or with a Programmable System-on-Chip (PSoC=E2=84= =A2) or Programmable Radio-on-Chip (PRoC=E2=84=A2) architecture. =0A=

These options cover IoT designs which range from entry-level prod= ucts to networks which need to meet ultra-high performance targets or ult= ra-low power consumption to extend battery life.=0A

Find out more!

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Simplify the creation of stand-out features using t= he flexibility of FPGA

The flexibility of the FPGA arch= itecture enables high levels of product differentiation based on single-c= hip solutions or FPGAs optimised for saving space, energy consumption and= cost, or increasing IoT security.=0A

There are ultra-thin FPGAs f= or space-constrained systems, and FPGAs which offer the highest levels of= functional integration including an ARM=E2=84=A2-based proces= sor and robust security features as well as high-density I/O.=0A

= Find out more!
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Future Electron= ics - EMEA Headquarters - London, Future House, The Glanty, Egham,= Surrey, TW20 9AH, UK=0A

I= f you're having problems viewing this message, please click here=0A
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