Return-Path: Delivered-To: contact@reparatii-laptopuri.ro Received: (qmail 4177 invoked by uid 1008); 7 Oct 2014 12:04:25 +0300 Received: by simscan 1.4.0 ppid: 4171, pid: 4172, t: 1.9312s scanners: regex: 1.4.0 clamav: 0.97.2 /m: spam: 3.3.1 X-Spam-Checker-Version: SpamAssassin 3.3.2 (2011-06-06) on zenit X-Spam-Level: X-Spam-Status: No, score=0.3 required=5.5 tests=HTML_MESSAGE, RCVD_IN_DNSWL_NONE,T_DKIM_INVALID,URIBL_RHS_DOB autolearn=disabled version=3.3.2 Received: from 105-64.mta.dotmailer.com (94.143.105.64) by mail.reparatii-laptopuri.ro with SMTP; 7 Oct 2014 12:04:23 +0300 DKIM-Signature: v=1; a=rsa-sha1; c=relaxed/relaxed; s=dkim1024; d=my-futureproductnewsletter.com; h=From:To:Subject:MIME-Version:Content-Type:Date:List-Unsubscribe:Reply-To:Message-ID; i=future@my-futureproductnewsletter.com; bh=/HOfy1AzcVARQos2ukze/cEEpgw=; b=IurAj5w5myKkFqjzqEMJRxMcX/V/yK8IVmnVdHeyy0/KeLroqP8dyiDoTrUCS1Tl6CIywvwIEJ9w 6Qt7m2o63VnEQUVse15ucNSwVngKCu/cRXdiAD0MP9gewuf5vpRKc6Kvi+2w8L0f3BTr6OZNw+l9 PYfcWYAxWzMJT/s579g= DomainKey-Signature: a=rsa-sha1; c=nofws; q=dns; s=dkim1024; d=my-futureproductnewsletter.com; b=SqrfSBNV/rr9fYJvBcQ4FzndDwSlJkBn0Fhd40OqlDIErLfEtc7/vp/ldyR2sAAUSGMsq32qtV/H BUayGRnar/oNnnAPCnk2JByITLzDfzITPbvcuReZ3Vlpf2X28u1fKk4Tgf2jNadDCvALG9pOraWb azP6K2/rdbgactUUaoY=; From: "Future Product News" To: "contact@reparatii-laptopuri.ro" Subject: Future's Electronica Special - IoT Collect MIME-Version: 1.0 Content-Type: multipart/alternative; boundary="BFBHX9KLB5:20141007101247382" X-Mailer: dmDroid Date: Tue, 07 Oct 2014 10:12:47 +0100 X-CampaignID: KFRXP X-dmid: 1TFB-2S375-BHX9KL List-Unsubscribe: Bounces-to: bo-1TFB-2S375-BHX9KL-BZOWT@my-futureproductnewsletter.com Return-Path: bo-1TFB-2S375-BHX9KL-BZOWT@my-futureproductnewsletter.com Reply-To: "Future Product News" Message-ID: <2S375.BFBHX9KLB5.20141007101247382@my-futureproductnewsletter.com> X-AntiVirus: checked (incoming) by Avira MailGuard (Version: 15.0.9.460; AVE:8.3.30.16; VDF:8.11.224.22) --BFBHX9KLB5:20141007101247382 Content-Type: text/plain; charset="utf-8" Content-Transfer-Encoding: quoted-printable ( future@my-futureproductnewsletter.com ) future@my-futureproductnewsletter.com ( future@my-futureproductnewsletter= .com ) ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-18Y0JI-0/c.aspx= ) ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-18Y0JJ-0/c.aspx= ) ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-18Y0JK-0/c.aspx= ) ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-18Y0JL-0/c.aspx= ) Product Newsletter - Sep 14 ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-18Y0JM-0/c.aspx= ) In This Issue: Collect your IoT Solutions Cube at Electronica Stand A4-259=20 Compact & rugged gyroscopes=20 Accurate temperature sensing=20 Humidity & temperature sensor MEMS pressure sensors=20 Actuator sensors=20 Proximity sensors=20 Light sensors=20 Sound sensors Rugged MEMS gyroscopes combine accuracy with stability and power savings ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-18Y4QZ-0/c.aspx= ) With analogue or digital outputs and excellent noise immunity, STMicroele= ctronics=E2=80=99 silicon-based MEMS gyroscopes also offer superior stabi= lity over time and temperature, as well as low power consumption. Whilst the three-axis sensors include a full-scale range up to =C2=B12000= dps and an embedded FIFO for smart data storage and power management, the= range also includes single- and dual-axis gyroscopes. Find out more! ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-= 18Y4QZ-0/c.aspx ) Accurate and robust temperature sensing for digital or analogue designs ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-19OH8B-0/c.aspx= ) The latest digital-output temperature-sensor ICs combine multi-channel op= eration for remote-sensing applications with accuracy down to =C2=B10.25=C2= =B0C in addition to power-saving features and connectivity over I2C, SPI,= SMBus or logic. For analogue outputs, the latest ICs achieve accuracy of =C2=B10.5=C2=B0C= with sensor gains from -10.68 to 19.5 and a wide temperature range of -5= 5 to +130=C2=B0C. Discover more by requesting the Data Pack. Find out more! ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-= 19OH8B-0/c.aspx ) Humidity and temperature sensing in a single, ultra=E2=80=91compact senso= r ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-18Y4R0-0/c.aspx= ) Packed into a tiny 2 x 2 x 0.9mm package is a sensing element and analogu= e-to-digital conversion which delviers humidity and temperature data as a= 16-bit digital output. STMicroelectronics' factory-calibrated capacitive digital sensor technolo= gy offers high-accuracy for humidity and temperature data, as well as ser= ial connectivity and low power consumption. This sensor is also ECOPACK=C2= =AE compliant. Find out more! ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-= 18Y4R0-0/c.aspx ) Ultra-compact MEMS pressure sensor uses state=E2=80=91of=E2=80=91the-art = VENSENS technology ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-18Y4R1-0/c.aspx= ) The combination of a mono=E2=80=91silicon membrane above an air gap with = a defined pressure enables STMicroelectronics' VENSENS technology to deli= ver high-accuracy pressure sensing with an I2C or SPI output. The high integration of the LPS331AP includes embedded temperature compen= sation and 24=E2=80=91bit ADC with low power consumption and a low operat= ing voltage in a space-saving Ecopack=C2=AE package. Find out more! ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-= 18Y4R1-0/c.aspx ) Choosing technologies for sensing motion, acceleration, shock, position &= speed ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-18Y4R2-0/c.aspx= ) With so many actuators and actuator technologies on the market, choosing = the right one can be complex and time-consuming. This Data Pack from Futu= re includes an actuator for every application. The Data Pack includes analogue and digital accelerometers, a digital com= pass, pyroelectric IR and and phototransistor motion sensors as well as H= all IC, optical and magnetic speed and position sensors. Find out more! ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-= 18Y4R2-0/c.aspx ) Proximity sensing using capacitive, resistive, optical or IR reflective s= ensors ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-18Y4R3-0/c.aspx= ) With capacitive touch sensors moving into more demanding applications, IR= reflective sensors now integrate ambient-light compensation to extend th= eir range from bright sunlight or dark rooms. Resistive sensors now integrate multi-touch gestures and haptic feedback = from an ultra-small footprint, whilst optical sensors have introduced mor= e compact packages. Find out more by requesting the Data Pack. Find out more! ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-= 18Y4R3-0/c.aspx ) Increased integration and flexibility from new light and CMOS image senso= rs ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-18Y4R4-0/c.aspx= ) Analogue light sensors offer the flexibility of converting light to frequ= ency or to voltage whilst the latest digital light sensors integrate anal= ogue=E2=80=91to=E2=80=91digital conversion and serial connectivity for ea= sier interfacing. For CMOS image sensors, there is the flexibility to use wider range of sh= utter options for digital camera and imaging applications, including pipe= lined, triggered global or rolling shutters. Find out more! ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-= 18Y4R4-0/c.aspx ) MEMS Microphones and ultrasonic sensors using piezoelectric ceramic techn= ology ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-18Y4R5-0/c.aspx= ) The latest MEMS microphones deliver a smaller size and a higher performan= ce compared to conventional electrets condenser microphones and offer low= power consumption and a choice of port location. For ultrasonic sensors, the latest developments include high sensitivity = and reliability combined with a small and lightweight package. To find ou= t more, request the Sound Sensors Data Pack. Find out more! ( http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL-= 18Y4R5-0/c.aspx ) Future Electronics - EMEA Headquarters - London, Future House, The Glanty= , Egham, Surrey, TW20 9AH, UK If you're having problems viewing this message, please click here http://= my-futureproductnewsletter.com/1TFB-2S375-BFBHX9KLB5/cr.aspx Unsubscribe http://my-futureproductnewsletter.com/1TFB-2S375-BFBHX9KLB5/u= ns.aspx | Forward to a friend http://my-futureproductnewsletter.com/1TFB-= 2S375-BFBHX9KLB5-0/fw.aspx --BFBHX9KLB5:20141007101247382 Content-Type: text/html; charset="utf-8" Content-Transfer-Encoding: quoted-printable Future's Electronica Special - IoT Collect =0A=0A=0A=0A =0A =0A =0A =0A =0A =0A =0A =0A = =0A =0A =0A =0A
If you're having problems viewing this message, plea= se click here=0A
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Future IoT Sp= ecial - Oct 14
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I= n This Issue:
=0A=0ACollect your IoT Solutions C= ube at
Electronica Stand A4-259=0A=0A
    =0A
  • Compact & rug= ged gyroscopes
    • =0A
  • Accurate temperature sensing
    • =0A=
  • Humidity & temperature sensor
    • =0A
  • MEMS pressure sen= sors
    • =0A
  • Actuator sensors
    • =0A
  • Proximity senso= rs
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  • Light sensors
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  • Sound sensors
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Rugged MEMS gyroscopes combine accuracy with stability and pow= er savings

With analogue or digital outputs and excelle= nt noise immunity, STMicroelectronics=E2=80=99 silicon-based MEMS gyrosco= pes also offer superior stability over time and temperature, as well as l= ow power consumption.=0A

Whilst the three-axis sensors include a f= ull-scale range up to =C2=B12000dps and an embedded FIFO for smart data s= torage and power management, the range also includes single- and dual-axi= s gyroscopes. =0A

Find out more!=0A
=0A =0A =0A = =0A = =0A =0A =0A =0A =0A =0A = =0A
=0A = 3D"Future_Story_2"=0A =0A
Accura= te and robust temperature sensing for digital or analogue designs =

The latest digital-output temperature-sensor ICs combine mult= i-channel operation for remote-sensing applications with accuracy down to= =C2=B10.25=C2=B0C in addition to power-saving features and connectivity = over I2C, SPI, SMBus or logic.=0A

For analogue outputs,= the latest ICs achieve accuracy of =C2=B10.5=C2=B0C with sensor gains fr= om -10.68 to 19.5 and a wide temperature range of -55 to +130=C2=B0C. Dis= cover more by requesting the Data Pack.=0A

Find out more!=0A
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=0A= 3D"Future_Story_3"=0A =0A
Humidity and temperature sensing in a single, u= ltra=E2=80=91compact sensor

Packed into a tiny 2 x 2 x = 0.9mm package is a sensing element and analogue-to-digital conversion whi= ch delviers humidity and temperature data as a 16-bit digital output. =0A=

STMicroelectronics' factory-calibrated capacitive digital sensor = technology offers high-accuracy for humidity and temperature data, as wel= l as serial connectivity and low power consumption. This sensor is also E= COPACK=C2=AE compliant.

Find ou= t more!=0A


=0A =0A = =0A =0A =0A =0A =0A =0A =0A = =0A = =0A =0A
=0A 3D"Future_Story==0A
Ultra-compact MEMS pressure sensor uses state=E2=80=91of=E2= =80=91the-art VENSENS technology

The combination of a m= ono=E2=80=91silicon membrane above an air gap with a defined pressure ena= bles STMicroelectronics' VENSENS technology to deliver high-accuracy pres= sure sensing with an I2C or SPI output. =0A

The high i= ntegration of the LPS331AP includes embedded temperature compensation and= 24=E2=80=91bit ADC with low power consumption and a low operating voltag= e in a space-saving Ecopack=C2=AE package.=0A

Find out more!=0A
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=0A 3D"Future_S==0A
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Choosing technologie= s for sensing motion,=0Aacceleration, shock, position & speed<= /a>

With so many actuators and actuator technologies on the market= , choosing the right one can be complex and time-consuming. This Data Pac= k from Future includes an actuator for every application. =0A

The= Data Pack includes analogue and digital accelerometers, a digital compas= s, pyroelectric IR and and phototransistor motion sensors as well as Hall= IC, optical and magnetic speed and position sensors.=0A

Find out more!=0A
=0A = =0A =0A =0A =0A =0A = =0A =0A = =0A =0A =0A <= /tbody>=0A
=0A =3D"Future_Story_2"=0A
Proximity sensing using capacitive, resist= ive, optical or IR reflective sensors

With capacitive t= ouch sensors moving into more demanding applications, IR reflective senso= rs now integrate ambient-light compensation to extend their range from br= ight sunlight or dark rooms. =0A

Resistive sensors now integrate m= ulti-touch gestures and haptic feedback from an ultra-small footprint, wh= ilst optical sensors have introduced more compact packages. Find out more= by requesting the Data Pack.=0A

Find out = more!=0A

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=0A= 3D"Future_Story_3"=0A
Increased integration and flexibility from new li= ght and CMOS image sensors

Analogue light sensors offer= the flexibility of converting light to frequency or to voltage whilst th= e latest digital light sensors integrate analogue=E2=80=91to=E2=80=91digi= tal conversion and serial connectivity for easier interfacing.=0A

= For CMOS image sensors, there is the flexibility to use wider range of sh= utter options for digital camera and imaging applications, including pipe= lined, triggered global or rolling shutters.=0A

Find out more!=0A
=0A =0A = =0A =0A =0A =0A =0A =0A =0A = =0A =0A =0A
=0A 3D"Futur==0A
MEMS Microphones and ultrasonic sensors using piezoelec= tric ceramic technology

The latest MEMS microphones del= iver a smaller size and a higher performance compared to conventional ele= ctrets condenser microphones and offer low power consumption and a choice= of port location. =0A

For ultrasonic sensors, the latest develop= ments include high sensitivity and reliability combined with a small and = lightweight package. To find out more, request the Sound Sensors Data Pac= k.=0A

Find out more!=0A
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Future Electronics - EMEA Headquarters - London, Future Ho= use, The Glanty, Egham, Surrey, TW20 9AH, UK=0A
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=0A=0A=0A<= img src=3D"http://my-futureproductnewsletter.com/1TFB-2S375-BHX9KL/o.gif"= width=3D"1" height=3D"1" alt=3D"" style=3D"display:block;"> --BFBHX9KLB5:20141007101247382--