Return-Path: Delivered-To: contact@reparatii-laptopuri.ro Received: (qmail 16941 invoked by uid 1008); 20 Mar 2014 16:13:32 +0200 Received: by simscan 1.4.0 ppid: 16935, pid: 16936, t: 1.6557s scanners: regex: 1.4.0 clamav: 0.97.2 /m: spam: 3.3.1 X-Spam-Checker-Version: SpamAssassin 3.3.2 (2011-06-06) on zenit X-Spam-Level: X-Spam-Status: No, score=0.0 required=5.5 tests=HTML_MESSAGE, RCVD_IN_DNSWL_NONE,T_DKIM_INVALID autolearn=disabled version=3.3.2 Received: from 105-64.mta.dotmailer.com (94.143.105.64) by mail.reparatii-laptopuri.ro with SMTP; 20 Mar 2014 16:13:30 +0200 DKIM-Signature: v=1; a=rsa-sha1; c=relaxed/relaxed; s=dkim1024; d=my-futureproductnewsletter.com; h=From:To:Subject:MIME-Version:Content-Type:Date:List-Unsubscribe:Reply-To:Message-ID; i=future@my-futureproductnewsletter.com; bh=IZD6D12uoVtmD9XP1K+E5Wxt77Y=; b=WvWjIT3r/qhp2KXoa2A7og8+stwvIIHF3YJ7fsDDBwB2bhx+KfpMlHdE1xHJgaTtEY8VS2UWmfqE 7mg+bdtu3oQigZrNmbQEy9a8FA2XeB1tF25GFnsvTSbzZEBLPze1zG0hA3452qO4jXVv6Ux0iw7v gk34my9BEV1zxfj1Miw= DomainKey-Signature: a=rsa-sha1; c=nofws; q=dns; s=dkim1024; d=my-futureproductnewsletter.com; b=ZvQ0ucYinB6iSJs3C3XzZnZiP5FEVzr0n4REFs4KKN1dA8kii1PDg/QamrKQO9+IM5J/DnFNVcu+ nDL7c9GnLOCUYCfy0vr7d9ba02fGNl5tGHLH6Ohf1aIGC/dwneqPQzUkPGnGvnuUyfNeK5fVtNtR rbWTE2j8FYM4QYyfQUA=; From: "Future Product News" To: "contact@reparatii-laptopuri.ro" Subject: Apply for Dev Kits and Samples for motor control, 32-bit prototyping, power design and more... MIME-Version: 1.0 Content-Type: multipart/alternative; boundary="BFBHX9KLB5:20140320142103013" X-Mailer: dmDroid Date: Thu, 20 Mar 2014 14:21:03 +0000 X-CampaignID: IJJCL X-dmid: 1TFB-29VMZ-BHX9KL List-Unsubscribe: Bounces-to: bo-1TFB-29VMZ-BHX9KL-BZOFN@my-futureproductnewsletter.com Return-Path: bo-1TFB-29VMZ-BHX9KL-BZOFN@my-futureproductnewsletter.com Reply-To: "Future Product News" Message-ID: <29VMZ.BFBHX9KLB5.20140320142103013@my-futureproductnewsletter.com> X-AntiVirus: checked (incoming) by Avira MailGuard (Version: 15.0.9.460; AVE:8.3.30.16; VDF:8.11.224.22) --BFBHX9KLB5:20140320142103013 Content-Type: text/plain; charset="utf-8" Content-Transfer-Encoding: quoted-printable ( future@my-futureproductnewsletter.com ) future@my-futureproductnewsletter.com ( future@my-futureproductnewsletter= .com ) ( http://my-futureproductnewsletter.com/1TFB-29VMZ-BHX9KL-YYE1E-0/c.aspx = ) ( http://my-futureproductnewsletter.com/1TFB-29VMZ-BHX9KL-YYE1F-0/c.aspx = ) ( http://my-futureproductnewsletter.com/1TFB-29VMZ-BHX9KL-YYE1G-0/c.aspx = ) ( http://my-futureproductnewsletter.com/1TFB-29VMZ-BHX9KL-Z87BV-0/c.aspx = ) Product Newsletter - Mar 14 In This Issue: Request STM Nucleo Boards Now! Dual power modules save space Webinar: motion-control simplified! Fan-free 100W AC-DC supply A power-density breakthrough Up to 90% lower switching loss STM32 Nucleo boards available now via Future=E2=80=99s exclusive Board Club ( http://my-futureproductnewsletter.com/1TFB-29VMZ-BHX9KL-Z87B= R-0/c.aspx ) STMicroelectronics=E2=80=99 Nucleo boards combine the strengths of ARM=C2= =AE mbed=E2=84=A2 and Arduino to fast-track software and hardware develop= ment for prototyping designs based on any STM32 32-bit ARM-based MCU. Nucleo boards are the latest to be added to the exclusive offers on Futur= e Electronics=E2=80=99 Board Club which provides boards, at no cost, to q= ualifying applications. Datas + Sample & Dev Boards Request ( http://my-futureproductnewsletter.c= om/1TFB-29VMZ-BHX9KL-Z87BR-0/c.aspx ) Benchmark power density from dual 6A modules. Dev board available now! ( = http://my-futureproductnewsletter.com/1TFB-29VMZ-BHX9KL-Z87BT-0/c.aspx ) Higher integration and power density, with 4.5V to 22V inputs and an ultr= a-low profile, mean that the XRP9710/11 needs only half of the board spac= e of conventional 6A modules. Inside the compact 12x12x2.75mm package, Exar=E2=80=99s XRP9710/11 progra= mmable step-down power modules feature two fully integrated channels and = two controller outputs, each capable of driving loads up to 30A. Data + Sample & Dev Board Request ( http://my-futureproductnewsletter.com= /1TFB-29VMZ-BHX9KL-Z87BT-0/c.aspx ) Motion control Simplified! Register for Webinar Mar 27 & Apply for Dev Bo= ard now! ( http://my-futureproductnewsletter.com/1TFB-29VMZ-BHX9KL-Z87BO-= 0/c.aspx ) NXP=E2=80=99s LPC1500 microcontrollers combine an ARM=C2=AE Cortex=E2=84=A2= M-3 core with extensive motor-control peripherals and ultra-efficient fi= rmware for high-accuracy and flexible control of two sensored or sensorle= ss motors. Easy, GUI-based tools provide the expertise to control brushless DC, perm= anent-magnet synchronous, and AC induction motors with the low-power LPC1= 500. oin the Webinar and apply for the dev board to learn more! Datas + Sample Request ( http://my-futureproductnewsletter.com/1TFB-29VMZ= -BHX9KL-Z87BO-0/c.aspx ) Register for the Webinar! ( http://my-futureproductnewsletter.com/1TFB-29= VMZ-BHX9KL-Z87BU-0/c.aspx ) New Converter-housed-in-Package (ChiP) from Vicor achieves x4 power densi= ty ( http://my-futureproductnewsletter.com/1TFB-29VMZ-BHX9KL-Z87BS-0/c.as= px ) Using Vicor=E2=80=99s new Convertor-housed-in-Package (ChiP) technology, = the 380V DC, BCM380 bus converter reaches a x4 increase in power density,= at 115W/cm=C2=B3, for a 1.2kW output from a 14.5cm=C2=B2 footprint. Measuring just 63mmx23mm, with a height of 7.3mm, the BCM380 also integra= tes Vicor=E2=80=99s ZCS/ZVS Sine Amplitude Converter=E2=84=A2 topology to= provide low noise operation and fast response times. Data + Sample Request ( http://my-futureproductnewsletter.com/1TFB-29VMZ-= BHX9KL-Z87BS-0/c.aspx ) Baseplate-cooling for low-profile VBM-100 power supply from CUI Inc. ( http://my-futureproductnewsletter.com/1TFB-29VMZ-BHX9KL-Z87BQ-= 0/c.aspx ) The combination of an ultra-low profile, 17mm board-mount module and base= plate cooling enables the VBM-100 AC-DC supply to save space in ITE, tele= coms and industrial applications. In addition to saving space in these high-density systems, CUI Inc=E2=80=99= s VBM-100 supply can also be used in systems where noise restrictions lim= it the use of fans for thermal management. Data + Sample Request ( http://my-futureproductnewsletter.com/1TFB-29VMZ-= BHX9KL-Z87BQ-0/c.aspx ) First SiC MOSFET with co-packaged anti-parallel SiC Schottky Barrier Diode ( http://my-futurepr= oductnewsletter.com/1TFB-29VMZ-BHX9KL-Z87BP-0/c.aspx ) ROHM=E2=80=99s new 1200V Silicon Carbide (SiC) MOSFETs achieve 90% lower = switching losses than silicon alternatives and include the first to be co= -packaged with a discrete anti-parallel SiC Schottky barrier diode. The combination of higher efficiency and power density, with a lower syst= em BOM, enables these SiC MOSFETs to replace silicon MOSFETs and IGBTs in= next-generation power-conversion systems. Data + Sample Request ( http://my-futureproductnewsletter.com/1TFB-29VMZ-= BHX9KL-Z87BP-0/c.aspx ) Future Electronics - EMEA Headquarters - London, Future House, The Glanty= , Egham, Surrey, TW20 9AH, UK If you're having problems viewing this message, please click here http://= my-futureproductnewsletter.com/1TFB-29VMZ-BFBHX9KLB5/cr.aspx Unsubscribe http://my-futureproductnewsletter.com/1TFB-29VMZ-BFBHX9KLB5/u= ns.aspx | Forward to a friend http://my-futureproductnewsletter.com/1TFB-= 29VMZ-BFBHX9KLB5-0/fw.aspx --BFBHX9KLB5:20140320142103013 Content-Type: text/html; charset="utf-8" Content-Transfer-Encoding: quoted-printable Apply for Dev Kits and Samples for motor control, 32-bit prototypi= ng, power design and more... =0A=0A=0A=0A =0A =0A =0A= =0A =0A =0A=0A
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3D"Future_Email"=0A = <= span style=3D"color: rgb(255, 255, 255);">future@my-futureproductnewslett= er.com=0A 3D"Future_Facebook"=0A= 3D"Future_Twitter"=0A 3D"Future_YouTube"=0A
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Product Newslette= r - Mar 14
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In This Issue:
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    =0A=
  • Request STM Nucleo Boards Now!
    • =0A=
  • Dual power modules save space
    • =0A<= li style=3D"font-size: 12px;">Webinar: motion-control simplified!
    =0A
  • Fan-free 100W AC-DC supply
    =0A
  • A power-density breakthrough
    • = =0A
  • Up to 90% lower switching loss
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=0A 3D"Future_Story_3"=0A
= STM32 Nucleo boards available now=0Avia Future=E2=80=99s exclusive
B= oard Club=0A

STMicroelectronics=E2=80=99 Nucleo boards = combine the strengths of ARM=C2=AE mbed=E2=84=A2 an= d Arduino to fast-track software and hardware development for prototyping= designs based on any STM32 32-bit ARM-based MCU.

Nucleo boards ar= e the latest to be added to the exclusive offers on Future Electronics=E2= =80=99 Board Club which provides boards, at no cost, to qualifying applic= ations.=0A

Data + Sample & Dev Boards R= equest
=0A =0A 		=0A = =0A =0A = =0A = =0A =0A =0A =0A =0A =0A =0A =
=0A 3D"Future_Story_2"=0A =0A
Benchma= rk power density from dual 6A modules. Dev board available now!=0A

=0AHigher integration and power density, with 4.5V to 22V inp= uts and an ultra-low profile, mean that the XRP9710/11 needs only half of= the board space of conventional 6A modules.

Inside the compact 1= 2x12x2.75mm package, Exar=E2=80=99s XRP9710/11 programmable step-down pow= er modules feature two fully integrated channels and two controller outpu= ts, each capable of driving loads up to 30A.

Data + Sample & Dev Board Request
=0A =
=0A =0A =0A= =0A =0A <= /tr>=0A =0A
=0A = =0A = =0A =0A =0A =0A =0A = =0A <= /tr>=0A =0A
=0A 3D"Future_Story_1"=0A =
Motion control Simplified! Register for W= ebinar Mar 27 & Apply for Dev Board now!=0A

NXP=E2=80= =99s LPC1500 microcontrollers combine an ARM=C2=AE Cortex= =E2=84=A2 M-3 core with extensive motor-control peripherals and ult= ra-efficient firmware for high-accuracy and flexible control of two senso= red or sensorless motors.

Easy, GUI-based tools provide the expert= ise to control brushless DC, permanent-magnet synchronous, and AC inducti= on motors with the low-power LPC1500. Join the Webinar and apply for the = dev board to learn more!

=0AData + Sample = Request=0A

Register for the Webinar!
=0A =0A <= /td>=0A =0A 		=0A =0A = =0A =0A =0A =0A =0A =0A = =0A =0A =0A
=0A 3D"Future_Stor==0A=
New Converter-housed-in-Pack= age (ChiP) from Vicor achieves x4 power density =0A

Usi= ng Vicor=E2=80=99s new Convertor-housed-in-Package (ChiP) technology, the= 380V DC, BCM380 bus converter reaches a x4 increase in power density, at= 115W/cm=C2=B3, for a 1.2kW output from a 14.5cm=C2=B2 footprint.

= Measuring just 63mmx23mm, with a height of 7.3mm, the BCM380 also integra= tes Vicor=E2=80=99s ZCS/ZVS Sine Amplitude Converter=E2=84=A2 topology to= provide low noise operation and fast response times.

Data + Sample Request
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=0A
=0A =0A =0A =0A = =0A =0A =0A = =0A <= /tr>=0A =0A = =0A =0A =0A
=0A
=0A = 3D"Future_Story_3"=0A
Basep= late-cooling for low-profile VBM-100 power supply from
CUI Inc.=0A

The combination of an ultra-low profile, 17mm board-m= ount module and baseplate cooling enables the VBM-100 AC-DC supply to sav= e space in ITE, telecoms and industrial applications.

In addition = to saving space in these high-density systems, CUI Inc=E2=80=99s VBM-100 = supply can also be used in systems where noise restrictions limit the use= of fans for thermal management.

=0AData + S= ample Request
=0A =0A 		=0A = =0A =0A =0A= =0A =0A = =0A =0A = =0A =0A =0A =
=0A= 3D"Future_Story_1"=0A
First SiC MOSFET with
co-packaged=0Aanti-parall= el SiC Schottky Barrier Diode=0A

=0AROHM=E2=80=99s new = 1200V Silicon Carbide (SiC) MOSFETs achieve 90% lower switching losses th= an silicon alternatives and include the first to be co-packaged with a di= screte anti-parallel SiC Schottky barrier diode.

The combination o= f higher efficiency and power density, with a lower system BOM, enables t= hese SiC MOSFETs to replace silicon MOSFETs and IGBTs in next-generation = power-conversion systems.

Data + Sample Req= uest
=0A
=0A
=0A =0A= =0A =0A = =0A =0A
Future Electronics - EMEA Headquarters - London, Fu= ture House, The Glanty, Egham, Surrey, TW20 9AH, UK=0A
=0A =0A =0A

If you're having problems viewing this messa= ge, please click here=0A
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