{"id":77,"date":"2015-06-03T19:58:34","date_gmt":"2015-06-03T19:58:34","guid":{"rendered":"http:\/\/catalin.webdesignexpert.ro\/?p=77"},"modified":"2015-09-16T16:56:51","modified_gmt":"2015-09-16T13:56:51","slug":"tehnologia-bga-smd","status":"publish","type":"post","link":"https:\/\/reparatii-laptopuri.ro\/?p=77","title":{"rendered":"Despre tehnologia BGA-SMD"},"content":{"rendered":"

\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Despre tehnologia BGA-SMD<\/h4>\n

\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 In istoria electronicii, pe masura ce tehnica a evoluat si din motive de miniaturizare , s-a trecut foarte rapid de la tehnologiile invechite cu componente, fie ele active sau pasive, cu picioruse strapunse prin placa de cablaj imprimat simplu strat, la tehnologii mult mai avansate. Astfel s-a ajuns la placi de cablaj multistrat (4,6 si chiar 10 straturi) si binenteles la miniaturizarea componentelor si lipirea lor in tehnologie SMD.<\/p>\n

\"schema<\/a>In electronica placilor de calculator au aparut chipuri ce aveau diferite roluri in structura placii de baza, denumite in functie de rolul lor northdbridge, southbridge, chip video, etc.<\/p>\n

Tehnologia de lipire a acestor chipuri pe placile de baza de calculatoare s-a numit BGA de la Ball Grid Array. O tehnologie ce foloseste pentru lipirea chipului o arie de \u201cbilute\u201d asezate si lipite dupa anumite forme si dimensiuni, incepand cu dimensiuni de 0.76 mm in diametru si ajungandu-se in zilele noastre la 0.35mm.<\/p>\n

Ca si aliaje de lipire, s-au folosit initial aliaje P37Sn63 ce aveau temperaturi de lichefiere mici (in jurul a 180 grade celsius) si erau foarte maleabile si rezistente la sfaramarea prin vibratii in exces de temperatura, datorita faptului ca aveau in compozitie plumbul, un metal neferos moale.<\/p>\n

\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Acest metal in schimb, s-a stabilit a fi toxic in cantitati mari si de aceea normele RoHS au impus interzicerea acestor aliaje ce au in compozitie plumbul.<\/p>\n

\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 S-a trecut la inlocuirea acestui aliaj cu unul mai putin periculos inlocuind plumbul cu cuprul si argintul.<\/p>\n

\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 In ziua de azi, foarte des intalnit in lipirea chipurilor este aliajul RoHS \u2013 CuSnAg cu concentratii de Ag intre 2 si 5%. Acest aliaj a dobandit o teperatura mai mare cu aproximativ 55 grade de lichefiere in detrimentul elasticitatii.<\/p>\n

\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Firma C&G IT MEDIASERV SRL \u00a0foloseste in reparatii doar aliaje de lipire si flux conforme standardelor RoHS !<\/p>\n

\"<\/a><\/p>\n

\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Pentru ca am facut o scurta introducere in lumea BGA, acum vom trece la modul de lucru si tehnologia folosita in placile de baza de laptop.<\/p>\n

\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Cele mai des intalnite defecte, atat ale placilor de baza de laptop cat si a celor video, sunt datorate dezlipirii sau sfaramarii bilutelor de contact de sub chipuri sau defectarii efective a unuia din chipurile BGA . Metodele de inlocuire ale acestor chipuri se face in patru pasi care necesita calm, rabdare, indemanare \u015fi experien\u0163a.<\/p>\n

 <\/p>\n

\"curatare<\/a>Pasul 1<\/strong> \u2013 desprinderea chipului (north, south sau chipului grafic) de pe placa. Se face cu aparatura specializata conforma standardelor in vigoare dupa anumite curbe de temperatura, timp in care \u201cbilutele\u201d de sub chipuri se lichefiaza. Nerespectarea acestor curbe de temperatura si folosirea unor dispozitive neadecvate, duce la incalzirea neuniforma a chipului, ceea ce poate conduce la deformarea fizica si distrugerea lui, deformarea iremediabila a placii de baza \u00a0sau la ruperea padurilor.<\/p>\n

 <\/p>\n

\"Despre<\/a>Pasul 2<\/strong>\u00a0-curatarea \u201cbilutelor\u201d de pe placa de baza laptop si de pe chip si verificarea integritatii acestora.<\/p>\n

Pasul 3<\/strong>\u00a0\u2013 In cazul in care chipul este defect sau \u00a0deformat se inlocuieste aceasta piesa laptop cu una noua.Daca chipul este ok se reface aria de bilute .<\/p>\n

 <\/p>\n

 <\/p>\n

\"reballing<\/a>Pasul 4<\/strong>\u00a0-reatasarea chipurilor la placa de baza, respectand din nou curbele de temperatura specificate de producatorul aliajului din care au fost facute bilutele.<\/p>\n

\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 In concluzie este o procedura minutioasa care necesita atentie sporita, dar si cunostinte temeinice.<\/p>\n

\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 In service-ul Reparatii Laptopuri gasiti atat tehnicieni pregatiti pentru a lucra cu aparatura de laborator, cat si toata aparatura necesara conform normelor europene RoHS pentru acest \u00a0bga smd chip replacement \u00a0pe placile de baza.<\/p>\n

\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Rata de succes a reparatiilor pe placa de baza \u00a0sau placa video este de peste 95%, pentru placile de baza defecte venite direct in service-ul nostru, neumblate empiric la ele, excluzand placile de baza peste care au fost varsate diverse lichide.<\/p>\n

\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Foarte inportant!<\/strong> Nu va lasati incantati de cei ce promit o rezolvare low-cost prin metoda de reflow cu un jet de aer cald. Aceasta este o metoda empirica invatata de pe youtube si poate produce mai mult rau decat beneficii . Este total contraindicata!!! Apelati la serviciul unui service dotat cu aparatura si competenta necesara.<\/p>\n","protected":false},"excerpt":{"rendered":"

\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Despre tehnologia BGA-SMD \u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 In istoria electronicii, pe masura ce tehnica a evoluat si din motive de miniaturizare , s-a trecut foarte rapid de la tehnologiile invechite cu componente, fie ele active sau pasive, cu picioruse strapunse prin placa de cablaj imprimat simplu strat, la tehnologii mult mai avansate. Astfel s-a ajuns la placi […]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[7],"tags":[],"acf":[],"yoast_head":"\ntehnologia-bga-smd bga smd chip replacement<\/title>\n<meta name=\"description\" content=\"bga smd chip replacement\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/reparatii-laptopuri.ro\/?p=77\" \/>\n<meta property=\"og:locale\" content=\"ro_RO\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"tehnologia-bga-smd bga smd chip replacement\" \/>\n<meta property=\"og:description\" content=\"bga smd chip replacement\" \/>\n<meta property=\"og:url\" content=\"https:\/\/reparatii-laptopuri.ro\/?p=77\" \/>\n<meta property=\"og:site_name\" content=\"Reparatii 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